Masuk
1099203345
Deskripsi Video

ID Video Stok: 1099203345

Semiconductor Packaging Process. Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab.

Informasi penting

Informasi rilis: Rilis model dan properti bertanda tangan yang disimpan di Shutterstock, Inc.

Format Video

Kecepatan frame

  • 25fps

Kontributor Video

© 2003-2024 Shutterstock, Inc.